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LDS+SMT Antenna for NB Application

3D-MID LDS Antenna (Customized)

規格:

  • Common resin materials as following:
  • PA (Polyamide)+ 30%GF
  • Electroplating thickness as following:
  • Cu = 8+/-2 um
  • Ni = 3+/-1 um
  • (Au > 0.05 um options)
  • Paint thickness as following:
  • Color: Customized

產品特性:

  • Lowest cost
  • Integrated contacts to ground plane
  • High volume capable production die
  • Additional assembly stations may be added for volume upswings