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LDS Antenna for Mobile Application

3D-MID LDS Antenna (Customized)

規格:


  • Common resin materials as following:
  • PC (Polycarbonate)
  • Electroplating thickness as following:
  • Cu = 8+/-2 um
  • Ni = 3+/-1 um
  • (Au > 0.05 um options)
  • Paint thickness as following:
  • Color: Customized


產品特性:


  • High degree of design flexibility.
  • Ability to make products smaller by creating antenna structures on the enclosure.
  • Facilitates quick change of antenna layouts easily without expensive tooling changes.
  • Resins available including popular PC, PC/ABS, ABS materials.
  • Offers cost-savings particularly for higher volume applications.